【转贴网址】 http://www.techpowerup.com/61716/Intel_Nehalem_Bloomsfield_CPU...-up_Before_Computex_2008.html来源
http://www.bit-tech.net/news/2008/05/30/...ow-up-in-taipei/1Intel Nehalem, Bloomsfield CPU and Tylersberg Chipset Close-up Before Computex 2008
When it comes to hot news from MSI, my favourite source has always been bit-tech.net. These guys have some very good connections with MSI. Now a week before Computex 2008, they have convinced MSI to let them get a close-up look at Intel's next generation Nehalem architecture, which is based on the Bloomsfield CPU platform and Tylersberg chipset also known under the X58 nomenclature. The following pictures show a 1366-pin quad-core Bloomsfield CPU (no model and specs for now) with HT support and integrated DDR3 memory controller. All Bloomsfield processors will require a new cooling. Regular LGA775 coolers won't fit. The Tylersberg X58 motherboard made by MSI has six DDR3 memory slots. Six becuase you'll need a minimum of three DDR3 DIMMs to run in triple-channel mode. The chipset also features 36 lanes of PCI-Express 2.0, so you’ll get a full x16 by x16 for at least two video card slots. The south bridge used with Tylersber is still ICH10, so don't expect extraordinary features when it comes to the number of SATA or USB 2.0 ports. Check out the rest of the pictures by the author Richard Swinburne over at bit-tech.net
稍微说明一下
也就是目前LGA775改成LGA1366
新的CPU将内建记忆体控制器，就像像在AMD一样
全部Bloomsfield 处理器将需要一新冷却。
一般的LGA775 冷却器将不适合。
支援DDR3 3通道
PCIE为2.0
南桥仍然是ICH10
姑且不论效能以目前DDR3价格那么高，加上目前Core2效能已经很足够一般消费者使用
而且对手又处于疲弱状态，新的规格出来又要经过一番大淘汰，相信大部人是不会更换的
所以看看就好～～
